IBM is developing new AI chips with Co-Packaged Optics (CPO)!

Networkworld.com reported that “IBM researchers are developing optical chips that are expected to significantly speed connectivity in data center systems, enabling better performance and lower energy costs for customers that need to build and support AI applications.” The December 9, 2024 article entitled “IBM optical chip prototype aims to speed AI computing and slash data center energy demands” (https://www.networkworld.com/article/3619912/ibm-optical-chip-prototype-aims-to-speed-ai-computing-and-slash-data-center-energy-demands.html) included these comments:

IBM said its co-packaged optics (CPO) prototype will redefine the way the computing industry transmits high-bandwidth data between chips, circuit boards, accelerators, servers and other devices by using a polymer material to direct optics rather than traditional glass-based fiber optics. 

Such so-called polymer waveguides promise lower costs and better flexibility and are less susceptible to interference than their glass counterparts, IBM said. There are a number of polymer fiber uses in the telecom arena, but few have been applied to the data center, IBM stated.

The CPO prototype module will offer high-bandwidth-density optical structures, coupled with the ability to transmit multiple wavelengths per optical channel, boosting bandwidth between chips as much as 80 times compared to traditional electrical connections, said Mukesh Khare, general manager of IBM’s semiconductors division and vice president of hybrid cloud research at IBM Research.

Sounds great for the IT community!